PRIMAE

PACKAGING OF FUTURE INTEGRATED MODULAR ELECTRONICS

Reference: 265413

Call: FP7-AAT-2010-RTD-1

Theme: transport

Scientist: Claudio Zilio

Department: Management and Engineering

UNIPD: participant

Total cost: 6,338,307 €

Eu Funding: 3,766,448 €

Email: claudio.zilio@unipd.it

Project Description

Affordable transport for the citizen relies on innovative solutions and technologies that will result in lower costs and lead-time of the aircraft and its systems. In this area, the packaging of on-board computers is an important contributor. The Packaging of futuRe Integrated ModulAr Electronics (PRIMAE) objective is to develop a new flexible, robust and open aeronautical packaging for the next generation of electronics and particularly to Integrated Modular Avionics. This new concept after standardization will be able to replace the 35 year old ARINC 600 standard. PRIMAE technical objectives are:

  • Reduce electronics packaging in terms of volume (50%) and weight (30%) and offer flexibility and growth capability
  • Reduce costs (20%) using market standard components
  • Enhance reliability (50%) through thermal and vibratory breakthrough
  • Mitigate EMC protection penalties in composite fuselage environment
  • Ensure fast production ramp up and support rapid final assembly on aircraft
  • Improve availability and reduce maintenance cost.In these domains significant technological studies, beyond the state of the art (cooling,  lightweight composite materials, electromagnetic interferences, power supply, connectivity), will be carried out in respect to airworthiness regulations.To achieve the PRIMAE objectives, 3 steps are required:
    • Definition phase of air framers and suppliers requirement - Research and evaluation of advanced packaging technologies
    • Specification and development of representative mock-up to integrate different technologies. The concept once harmonized among the main European players participating in this project, will be proposed as a standard for the future generation of large and regional aircraft, and helicopters. The new packaging concept will strengthen competitiveness of the market and will support the effort of industrial avionics suppliers to improve costs and environmental impacts. 

Partners

Coordinator: Thales Avionics SA

Participants: Institut National des Sciences Appliquées de Lyon, Emccons Dr Rasek GmbH & Co Kg, Vyzkumny a Zkusebni Letecky Ustav A.S., The Institute of Thermal Physics of the Ural Branch of the Russian Academy of Science, Alenia Aeronautica Spa, Dau Ges. m.b.h. & Co. Kg., Atm Przedsiebiorstwo Produkcyjne Sp. Z O.O, Tyco Electronics Uk Ltd, Bae Systems (Operations) Ltd, Diehl Aerospace GmbH, Radiall, Dassault Aviation Sa, Kontron Modular Computers Sas, Latelec, Aalto-Korkeakoulusaatio, Dutch Thermoplastic Components Bv, Celestica Valencia Sa, Airbus Operations SAS, Università degli Studi di Padova